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ECEN 4324 - Fundamentals of Microsystem Packaging


Catalog Data ECEN 4324 (3). Fundamentals of Microsystem Packaging. Introduction to the fundamentals of microsystems packaging. This is a seminar style course which surveys topics in microsystem packaging such as electrical package design, design for reliability, thermal management, multichip packaging, IC assembly, sealing and encapsulation, and board assembly. Restricted to seniors.
(Meets with ECEN 5324.)
Credits and Design 3 credit hours. Elective course.
Corequisite(s) ECEN 3410, Electromagnetic Waves and Transmission
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Last revised: 08-02-11, PM, ARP.