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ECEN 5375 - Microstructures Laboratory


Catalog Data ECEN 5375 (3). Microstructures Laboratory. A laboratory course offering experience in monolithic silicon integrated circuit fabrication techniques, including IC layout, pattern compiling and generation, mask making, oxidation, photolithography, diffusion, implantation, metallization, bonding, process analysis, testing. A design project is included.
(Meets with ECEN 4375.)
Credits and Design 3 credit hours: 2 hours of lecture and 3 hours of laboratory per week . Elective course.
Prerequisite(s) ECEN 3320, Semiconductor Devices
Textbook R.C. Jaeger, Modular Series on Solid State Devices, Volume V, Addison-Wesley, 1988
Instructor's notes
  
Course Objectives This course provides undergraduate students the unique opportunity to gain hands-on experience in the design, fabrication, characterization and testing of micron-sized structures. The course teaches students the basic microfabrication processes such as lithography, oxidation, diffusion, etching and deposition as well as the different characterization techniques. These techniques are then used to fabricate a variety of electronic devices such as p-n diodes, photodiodes, MOS capacitors and transistors. Students learn the operating fundamentals and the use of analysis equipment such as the M-gage, the dektak, the 4-point probe, the interference microscope, the ellipsometer and the scanning electron microscope. A large fraction of the class is devoted to the design, layout, fabrication and testing of p-MOS circuits. The course also demonstrates how the same technology can be used for the fabrication of micromechanical structures.
Topics Covered
  1. Introduction
  2. Optical lithography, mask making
  3. Thermal oxidation
  4. Oxide etching, oxide thickness characterization
  5. Silicon etching, MOS process technology
  6. Vacuum systems, scanning electron microscope
  7. Diffusion, junction depth analysis, ion implantation
  8. Circuit design and testing
  9. Metal deposition, evaporation, sputtering, CVD
  10. Contacts and interconnects
  11. Packaging and yield
  12. C-V analysis and interpretation
  13. CMOS logic and memory
  14. Bipolar transistor technology
  15. Circuit testing

Last revised: 08-02-11, PM, ARP.