Concept: Our goal is to create complex optical integrated circuits by embedding arbitrary sub-components, fibers, or opto-electronics in a thick photopolymer. After curing to a solid state, 3D direct-write lithography is used to write optical waveguides between these embedded components to interconnect the circuit.
Results: Below are phase-contrast photo-micrographs of a SMF-28 fiber tip embedded in photopolymer showing good adhesion and low stress. The image on the right shows ~4 micron wide index lines written on a 35 micron pitch in the center of a 1 mm-thick photopolymer.
