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METAL-INSULATOR TECHNOLOGY
Ultra-high-speed metal-insulator device technology
(solid-state electronic devices without semiconductors!)
Lab
Publications
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“Surface
plasmon devices,” Michael J. Estes and Garret Moddel, U.S. Patent No.
7,177,515 (2007).
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“Interconnected
High Speed Electron Tunneling Devices,” Michael J. Estes and Garret Moddel,
U.S. Patent No. 7,126,151 (2006).
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“Terahertz
Interconnect System and Applications,” Michael J. Estes and Garret Moddel,
U.S. Patent No. 6,967,347 (2005).
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"Macroelectronics: Perspectives on
Technology and Applications, " R. Reuss, with G. Moddel, et al., Proc.
IEEE 93 (7), 1239-1256 (2005).
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"Detectors at the Intersection of
Photons and Electromagnetic Fields or, Where Einstein Meets Maxwell,"
invited paper, B. Eliasson and G. Moddel, Spring Meeting of the Materials Research Society, San Francisco, March 28-April 1, 2005.
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"Terahertz
device integrated antenna for use in resonant and non-resonant modes and method," "Manoja
D. Weiss, Blake J. Eliasson and Garret Moddel, U.S. Patent No. 6,835,949
(2004).
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“High
speed electron tunneling device and applications,” G. Moddel, and B. J.
Eliasson, U.S. Patent No. 6,756,649,
issued 2004.
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“Metal-oxide
electron tunneling device for solar energy conversion,” B. J. Eliasson, and
G. Moddel, U.S. Patent No. 6,534,784,
issued 2003.
v
Metal-Insulator Diodes for Solar Energy
Conversion, Blake J. Eliasson, PhD Thesis,
2001.
Popular
Press
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Scientific American
v
IEEE Spectrum
Overview
v Metal-insulator
electronics
AFM image of
e-beam-lithography-formed MIIM diode
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